Manufacturing Process of Aluminum Substrates

Aluminum substrates are metal-clad laminates with excellent thermal dissipation properties. A standard single-layer structure comprises three components: circuit layer (copper foil), insulating layer, and metal substrate. For high-end applications, a five-layer configuration (e.g., circuit layer/insulating layer/aluminum substrate/insulating layer/circuit layer) may be used. Multilayer aluminum substrates are rare but achievable through bonding with aluminum-based adhesives or insulating layers.

Key Features of LED Aluminum Substrates
Aluminum substrates for LEDs are specialized printed circuit boards (PCBs) with aluminum alloy cores. Unlike traditional FR-4 fiberglass boards, aluminum substrates efficiently dissipate heat generated by high-power LEDs. Their structure includes:

Circuit Layer: Copper foil (1 oz to 10 oz thickness).
Insulating Layer: Thermally conductive dielectric material (0.003″ to 0.006″ thickness, UL-certified).
Base Layer: Aluminum alloy or copper (low-alloy Al-Mg-Si-based high-ductility metal for optimal mechanical and thermal performance).

Technical Advantages

1. Superior Thermal Management:
   • Ultra-low thermal resistance (typically <1.0°C/W) for rapid heat transfer.
   • Withstands high current loads and voltage up to 4,500 V.
   • Thermal conductivity ≥2.0 W/m·K.
2. Mechanical Durability:
   • RoHS-compliant and suitable for Surface Mount Technology (SMT).
   • Replaces fragile ceramic substrates while maintaining robustness.
3. Design Optimization:
   • Simplifies heatsink integration, reducing product size and assembly costs.
   • Extends component lifespan by lowering operational temperatures.
4. Performance Consistency:
   • Compatible with PCB line widths and thickness standards equivalent to FR-4.

Industrial Applications
Widely used in:

• High-power LED lighting systems
• Automotive electronics
• Power converters and motor controllers
• RF/microwave devices

Manufacturing Process Overview

1. 1.Material Preparation:
   • Select aluminum alloy substrate (e.g., 6061-T6) and pretreat surfaces for adhesion.
2. 2.Insulating Layer Formation:
   • Apply thermally conductive dielectric (e.g., epoxy resin filled with ceramic particles) via coating or pressing.
3. 3.Circuit Patterning:
   • Etch copper foil using photolithography to create precise circuits.
4. 4.Surface Finishing:
   • Apply protective coatings (e.g., HASL, ENIG) for solderability and corrosion resistance.
5. 5.Quality Assurance:
   • Validate thermal resistance, dielectric strength, and mechanical stability per IPC-2221B standards.

Comparative Performance

(Note: Technical terms aligned with IPC-4101 and IEC 61249-2 standards. Critical parameters based on industry test data.)