The density of epoxy boards ranges from 1.75 to 1.8 g/cm³.
Molecular Structure of Epoxy Resin
Epoxy resin is characterized by molecular chains containing reactive epoxy groups, which can be positioned at the ends, middle, or in cyclic structures within the chain. These groups undergo cross-linking reactions with various curing agents to form insoluble, non-melting three-dimensional cross-linked network polymers. Standard thickness varies from 0.5 to 100 mm. When exposed to high temperatures (up to 180°C), epoxy boards may undergo thermal deformation. It is generally advised to avoid heating them alongside metals to prevent potential metal plate deformation.
Off-White Lightweight Epoxy Board
Also known as white lightweight epoxy board, this variant offers excellent mechanical properties, heat resistance, and moisture resistance. With a smooth, pit-free surface and strict thickness tolerances, it outperforms conventional paper boards in hardness and resilience, providing superior support and reinforcement. Additionally, its thinner profile and eco-friendly composition enhance sustainability.
Epoxy Fiberglass Cloth Laminate
This laminate is produced by thermally compressing chemically treated alkaline-free fiberglass cloth (base material) with epoxy resin (binder). It exhibits:
- High mechanical strength under high-temperature conditions
- Stable electrical performance in high-humidity environments
- A pale cyan or light brown coloration
- A flawless surface free of bubbles, pits, and wrinkles
- Precision-cut edges and crack-free cross-sections